Two terminal single stripe orthogonal MR head

ABSTRACT

A method of making a thin film orthogonal MR head is provided which includes a single MR stripe, a first lead layer which has first and second ends and a second lead layer which has first and second ends, the first end of the first lead layer being connected to the bottom portion of the MR stripe and the first end of the second lead layer being connected to a top portion of the MR stripe. First and second terminals are provided, the second end of the first layer being connected to the first terminal and the second end of the second lead layer being connected to the second terminal. The second lead layer extends across the MR stripe between the top and bottom portions of the MR stripe so as to induce a magnetic bias field into the MR stripe when a sense current is conducted through the MR stripe via the first and second terminals. Only the first and second terminals are employed for providing sense current for the MR stripe and transverse biasing of the MR stripe. The first lead is substantially planar across a bottom portion of the MR stripe so that a well formed second pole tip of a write head portion can be constructed.

CROSS REFERENCE TO RELATED APPLICATION

This application is a division of application Ser. No. 08/292,647 filedAug. 18,1994, is now U.S. Pat. No. 5,557,491.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of making an orthogonalmagnetoresistive (MR) head and more particularly to an orthogonal MRhead which employs two terminals for conducting a sense current throughan MR stripe and for transversely biasing the MR stripe.

2. Description of the Related Art

An orthogonal MR head includes an MR stripe sandwiched between first andsecond gap layers which in turn are sandwiched between first and secondshield layers. The orthogonal MR head differs from the ordinary MR headin that the MR stripe extends perpendicular to its head surface, thehead surface being the surface which faces a magnetic medium for sensingread signals. The orthogonal MR head has a first lead, connected to abottom portion of the MR stripe, and a second lead, connected to a topportion of the MR stripe, the first lead and the bottom portion of theMR stripe forming a portion of the head surface.

The orthogonal MR head can be used alone or can be combined with a writehead in an integrated write/read structure. Two such integratedstructures are the "piggyback" head and the "merged" head. In thepiggyback and merged heads, a write head is stacked on top of an MR readhead. The merged head employs the second shield of the MR read head as afirst pole piece for the write head. In contrast the piggyback heademploys a separate layer for the first pole piece.

In a typical orthogonal MR head two terminals are employed forconducting a sense current through a pair of MR stripes. When the sensecurrent flows, the MR stripes back bias each other with a magnetic fieldwhich induces a longitudinal bias: The use of two MR stripes to inducelongitudinal bias inherently overbiases both of the MR stripes, causingthem to be less sensitive to a read signal. In order to overcome thisproblem it has been proposed that only a single MR stripe be employedand that the MR stripe be longitudinally biased by track edge exchangeor hard bias stabilization and transversely biased by a conductor whichextends laterally across the MR stripe between its top and bottomportions. However, this configuration requires at least an extraterminal for the conductor. An extra terminal increases the size of thehead and runs counter to the present day goal of minimizing head sizeand simplifying fabrication.

A problem is encountered in the construction of an integrated write/readhead that includes an orthogonal MR transducer. It is difficult to formthe second pole tip for the write head because of a nonplanarconfiguration of the layers which form the orthogonal MR transducer.This nonplanar configuration is caused by the contour of the first leadacross the bottom portion of the MR stripe. Still another problem of theorthogonal MR head is shorting between the second lead and either of thefirst and second shield layers at the head surface. This is caused bysmearing of the conductive material of the first and second shieldsduring lapping to form the head surface.

SUMMARY OF THE INVENTION

The present invention provides a thin film orthogonal MR head whichincludes a single MR stripe which is transversely biased by a conductorwhich extends laterally across the MR stripe between its top and bottomends. We have found that we can limit the number of terminals in thehead by employing the second lead layer as a conductor for transverselybiasing the MR stripe. Accordingly, in our invention the second leadlayer, which is connected to a top portion of the MR stripe, extendsacross the MR stripe between its top and bottom portions so that thisextension will induce a magnetic bias field into the MR stripe when thesense current is conducted through the MR stripe and the second leadlayer. With this arrangement only two terminals are required, oneterminal being connected to the first lead and the other terminal beingconnected to the second lead. When a sense current is conducted throughthe MR stripe via the first and second terminals, the MR stripe isautomatically transversely biased by the extension of the second leadacross the MR stripe, therefore obviating the need for the extraterminals for a separate conductor. The invention overcomes theoverbiasing problem caused by using two MR stripes.

The second lead which also serves as the biasing conductor, is a singlethin film layer which is substantially planar. An unexpected result fromthis construction is that the second lead layer is provided with moreprotection from shorting to the first shield layer than that provided bythe prior art orthogonal MR head. The present invention provides amid-gap insulation layer between the second lead and the MR stripe toelectrically insulate these layers from one another. The inventionextends the mid-gap insulation layer throughout the entire expanse ofthe second lead so as to provide an extra insulation layer in additionto the first gap layer for insulating the second lead from the firstshield layer.

The present invention also provides for a planarized extension of thefirst lead layer directly adjacent the second pole tip of a write headso that the second pole tip can be well-formed. This is accomplished byforming the MR stripe along with any additional layers laminatedtherewith in a planar configuration with longitudinal biasing layers ateach side edge of the MR stripe. Accordingly, when the first leadtransitions up onto the longitudinal biasing layers and the MR stripe itwill be planar immediately adjacent the second pole tip of the writehead. With this arrangement nonplanar configurations will not bereplicated into the second pole tip when it is constructed. The presentinvention also eliminates failure by inadvertent shorting between thefirst lead and either of the first and second shield layers at the headsurface. This is accomplished by a unique arrangement of shorting thefirst lead to both of the first and second shield layers by design andconnecting all of these layers to ground.

An object of the present invention is to provide an improved orthogonalMR head which employs a conductor for inducing transverse bias in asingle MR stripe.

Another object is to employ the second lead of an orthogonal MR head asa conductor for transversely biasing a single MR stripe wherein thesecond lead is constructed in its entirety as a single thin film layer.

A further object is to minimize shorting between the second lead layerand the first shield layer of an orthogonal MR head by providing anextra insulation layer between the first gap layer and the second leadlayer without sacrificing planarization during the construction of thehead.

Still another object is to provide a highly planar orthogonal MR head.

Yet another object is to provide an orthogonal MR head wherein a singleMR stripe can be transversely biased by a conductor without therequirement of additional terminals for conducting a current through theconductor.

Still another object is to provide a merged orthogonal MR head wherein aread head portion is sufficiently planar to support formation of asecond pole tip of a write head portion.

Still a further object is to accomplish any one or combination of theforegoing objects while eliminating as a failure mode shorting betweenthe MR stripe and either of the shield layers at the head surface of thehead.

Still another object is to provide an orthogonal MR head according tothe above objects which can be fabricated with few processing steps.

Still another object is to provide a method for constructing anorthogonal MR head according to any one or combination of objectshereinabove.

The foregoing, together with other objects, features and advantages ofthis invention, will become apparent when referring to the followingspecification, claims and the accompanying drawings.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of a magnetic disk drive.

FIG. 2 is a schematic cross-sectional elevation view of a merged MRhead.

FIG. 3 is a schematic planar illustration of some of the thin filmlayers of the present orthogonal MR head.

FIG. 4 is a schematic illustration similar to FIG. 3 except vias forconnections and other details are illustrated.

FIG. 5 is a head surface view taken along plane V--V of FIG. 4 includinga write head portion.

FIG. 6 is similar to FIG. 5 except it is taken along plane VI--VI ofFIG. 4.

FIG. 7 is similar to FIG. 5 except it is taken along plane VII--VII ofFIG. 4.

FIG. 8 is similar to FIG. 5 except it is taken along a, plane VIII--VIIIof FIG. 4.

FIG. 9 is a schematic illustration of circuitry for the presentorthogonal MR head.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to the drawings wherein like reference numerals designatelike or similar parts throughout the several views a magnetic disk drive20 is illustrated in FIG. 1 The drive 20 includes a spindle 22 whichsupports and rotates a disk 24. The spindle 22 is rotated by a motor 26which is controlled by motor controls 28. A magnetic head 30, which maybe a merged MR head according to the present invention, is mounted on aslider 32 which in turn is supported by a suspension and actuator arm34. The suspension and actuator arm 34 positions the slider 32 so thatthe magnetic head 30 is in a transducing relationship with a surface ofthe magnetic disk 24. When the disk 24 is rotated by the motor 26, airmoved by the top of the disk causes the slider to ride on an air-bearingslightly off of the surface of the disk. The magnetic head 30 is thenemployed for writing and reading information signals in multiplecircular tracks on the surface of the disk 24. These information signalsas well as servo signals for moving the slider to various tracks areprocessed by drive electronics 36 which is connected to the magnetichead 30.

FIG. 2 is a side cross-sectional elevation view of a front portion of amerged orthogonal MR head. The merged MR head 30 includes a write headportion which is stacked on top of an MR read head portion. The MR readhead portion includes an MR stripe 40 which is sandwiched between firstand second gap layers 42 and 44 which are in turn sandwiched betweenfirst and second shield layers 46 and 48. First and second leads (notshown in FIG. 2), which are connected to the MR stripe, and elements(not shown in FIG. 2) for longitudinally and transversely biasing the MRelement 40 will be described with reference to subsequent figures in thedrawings. The second shield layer 48 is employed as the first pole piecefor the write head. This type of head is referred to as a merged MRhead. In a piggyback MR head the first pole piece is a separate layer ontop of the second shield layer of the MR read head. A gap layer 50 issandwiched between the first pole piece 48 and a second pole piece 52.The forward ends of these pole pieces 48 and 52 form a first pole tip 54and a second pole tip 56 respectively which are magnetically separatedby the gap layer 50. A coil layer 58 and a second insulation layer 60are sandwiched between first and third insulation layers 62 and 64 whichare in mm sandwiched between the first and second pole pieces 48 and 52.The forward end of the insulation layer 62 establishes a zero throatlevel and the forward ends of all of the layers forward of the zerothroat level form an air bearing surface (ABS) 66. This air bearingsurface is constructed by lapping the front of the head until the airbearing surface has been formed. It should be understood that FIG. 2 isexemplary of a head which employs the present invention. Instead of amerged MR head the invention can be an MR read head only or can becombined with a write head to form a piggyback MR head.

FIG. 3 is a simplified schematic illustration of the present invention.The MR stripe 40 is oriented perpendicular to the head surface or ABS 66of the head with its easy axis extending parallel to the head surface.The MR stripe 40 is bounded by top and bottom edges 40T and 40B and sideedges 40S. A first lead 70 has a first end connected to a bottom surfaceportion 72 of the MR stripe and a second lead 74 has a first endconnected to a top surface portion 76 of the MR stripe. Second ends ofthe first and second leads 70 and 74 are connected to first and secondterminals 78 and 80 respectively. Longitudinal hard biasing layers 82and 84 are located adjacent the edges 40S of the MR stripe forlongitudinally biasing the MR stripe. The longitudinal biasingsubstantially establishes the MR stripe in a single domain state alongits easy axis so as to minimize Barkhausen noise. The bottom edge 40B ofthe MR stripe and a bottom edge of the first lead 70 form a portion ofthe head surface 66. The first terminal 78 is connected to ground andthe second terminal 80 is connected to magnetic head signals andcontrols 36. The connection of the first terminal 78 to ground has animportance which will be explained in more detail hereinafter.

In order to render the MR stripe sensitive to signals from adjacentmoving magnetic media it must be biased transversely to its easy axis. Aconductor extending across the MR stripe between its bottom and topportions 72 and 76 is employed to transversely bias the single MR stripe40. However, the conductor requires an additional terminal to providethe bias current. The present invention provides transverse biasing byconfiguring the second lead 74 so that it extends across the MR stripeand transversely biases the MR stripe when a sense current is applied tothe MR stripe via the terminals 78.and 80. With this arrangement onlytwo terminals are required.

As shown in FIG. 3, the lead 74 has first, second, third and fourthportions 85, 86, 87 and 88 respectively. A part of the first portion 85is connected to the top portion 76 of the MR stripe by a via 90 as shownin FIG. 4. This first portion 85 extends substantially transversely tothe MR stripe. The second portion 86 extends from the first portiondownwardly toward the head surface 66. The third portion 87 extendstransversely from the second portion across the MR stripe 40 and isinsulated therefrom which will be explained in more detail hereinafter.The fourth portion 88 extends from the third portion to the secondterminal 80. The entire second lead is a single thin film layer whichhas a substantially planar configuration. The construction of the secondlead will be discussed in more detail hereinafter.

FIG. 4 is similar to FIG. 3 except it shows more detail for an actualembodiment of the present invention. FIG. 6 is a cross-sectional viewtaken along plane VI--VI of FIG. 4 just above the head surface 66. Inreference to FIGS. 4 and 6, the first lead 70 is connected to a strap 92by a via 94 and the strap 92 is in turn connected to the first shieldlayer 46 by a via 96. This connects the first lead 70 to the firstshield 46 which is part of the scheme to eliminate as a failure modeelectrical shorting between the first and second shield layers and theMR stripe at the head surface which will be explained in more detailhereinafter. Still referring to FIGS. 4 and 6, the first lead 70 isconnected to another strap 98 by a via 100 and the strap 98 is connectedto the first shield layer 46 by a via 102. This redundantly connects thefirst lead 70 again to the first shield layer 46. As shown in FIG. 4 thevia 100 extends substantially the full length of the first lead 70 fromthe head surface 66 to the terminal 78 thereby substantially reducingthe resistance of the first lead, increasing the strength of sensedsignals. As shown in FIG. 4 the strap 92 is generally rectangular shapedwhile the strap 98 is a large triangular shape. A single thin filmdeposition forms the second lead 74 and both of the straps 92 and 98thereby simplifying the construction of the head.

FIG. 5 is a head surface or HBS view of the head taken along plane V--Vof FIG. 4. In reference to FIGS 4 and 5, a bottom portion of the MRstripe is connected to the second shield layer 48 by the first lead 70and via 104. The first lead 70 serves as a second gap layer in the areabetween the via while the second gap layer 44 provides a gap for theremainder of the head. Since the first lead 70 has been shorted by thevia 104 to the second shield layer 48, this completes the scheme ofconnecting the first and second shield layers 46 and 48 and the MRstripe at the head surface 66 thereby eliminating shorting between theselayers as a potential failure mode. Since the first lead 70 is groundedat the first terminal 78, the MR stripe and the first and second shieldlayers 46 and 48 are grounded so that any smearing of conductivematerial therebetween will not alter the circuit path and so will notaffect the operation of the head. It should be understood that the firstlead 70 could be placed under the MR stripe as an alternative in whichcase it would serve as a first gap layer at the head surface. With thisarrangement a via would have to be provided for shorting the first leadlayer 70 to the second shield layer 48 and the second gap layer 44 wouldbe provided without a via so as to provide a gap for the MR stripe atthe head surface 66. FIGS. 4 and 8 Show the first portion 85 of thesecond lead 74 connected to the MR stripe by the via 90.

It is important to note from FIG. 5 that the top and bottom surfaces ofthe longitudinal biasing layers 82 and 84 are coextensive with the MRstripe and top and bottom protective tantalum layers 106. This providesa substantially planar width which is greater than the width of thesecond pole tip 56. Accordingly, when the first lead 70 is deposited onthe top surfaces of the longitudinal biasing layers 82 and 84, the MRstripe and the tantalum layers 106, the first lead 70 is substantiallyplanar below the area of the second pole tip 56. With this arrangementthere are no steps in the first lead 70 directly below the second poletip 56 which would be replicated into the second pole tip during itsconstruction.

Since the second lead 74 is an electrical conductor it is necessary toinsulate the third portion 87 of this lead from the film surface of theMR stripe as the third portion extends transversely thereacross. Asshown in FIG. 6 this is accomplished by providing a mid-gap insulationlayer (MGI) 108 between the MR stripe and the third portion 87 of thesecond lead. We have discovered, however, that by extending this mid-gapinsulation layer 108 under the entire second lead it provides anadditional insulation layer to prevent any possible shorting between thesecond lead 74 and the first shield layer 46.

FIG. 9 shows exemplary circuitry for the merged orthogonal MR had 30.The first lead 70 is connected to the first and second shields 46 and 48and to ground. The MR stripe 40 is connected between the first andsecond leads 70 and 74. The second lead 74 extends across the MR stripeand is connected through the terminal 80 to drive electronics 36.

In reference to FIGS. 1 and 2, the method of making the thin filmorthogonal MR head may include the steps of forming the MR stripe 40,forming a first lead layer 70 having first and second ends, forming asecond lead layer 74 having first and second ends, connecting the firstend to the first lead layer 70 to a bottom portion 72 of the MR stripe,connecting a first end of the second lead layer 74 to a top portion 76of the MR stripe, and extending the second lead layer 74 across the MRstripe between its top and bottom portions 72 and 76 so as to positionthe second lead layer 74 in a magnetically coupled relationship with theMR stripe. The method may further include connecting the second end ofthe first lead layer 70 to a first terminal 78 and connecting the secondend of the second lead layer 74 to the second terminal 80. The methodmay further include forming the second lead layer 74 in a singledeposition step so that the second lead layer 74 is a single thin filmlead layer. The method may further include forming a first shield layer46, forming a first gap layer 42 on top of the first shield layer,forming a mid-gap insulation layer 108 (see FIGS. 6-8) on top of the MRstripe and the first gap layer 42, and forming the second lead layer 74on top of the mid-gap insulation layer 108. The method may also includeforming ground strap layers 92 and 98 in the same step as forming thesecond lead layer 74 and connecting the ground strap layer 98 to thesecond terminal 80. The method may still further include forming asecond gap layer 44 on top of the second lead layer 74 and the mid-gapinsulation layer 108, forming a second shield layer 48 on top of thesecond gap layer 44 and connecting the first lead layer 70 and the firstand second shield layers 46 and 48 to ground.

Clearly, other embodiments and modifications of this invention willoccur readily to those of ordinary skill in the art in view of theseteachings. Therefore, this invention is to be limited only by thefollowing claims, which include all such embodiments and modificationswhen viewed in conjunction with the above specification and accompanyingdrawing.

We claim:
 1. A method of making a thin film orthogonal MR read headwhich has an air bearing surface (ABS) comprising the unordered stepsof:forming an MR stripe with first and second end portions and a middleportion therebetween, the first end portion being adjacent the ABS andthe second end portion being recessed in the head from the ABS; forminga first lead layer having first and second ends; forming a second leadlayer having first and second ends; connecting the first end of thefirst lead layer to said first end portion of the MR stripe; connectingthe first end of the second lead layer to said second end portion of theMR stripe; forming only first and second terminals for the MR stripe;connecting the second end of the first lead layer to the first terminaland connecting the second end of the second lead layer to the secondterminal so that the MR stripe and the first and second lead layers areconnected in series across the first and second terminals; and extendingthe second lead layer substantially parallel to the ABS away from the MRstripe, thence extending the second lead layer in a turn of at leastsubstantially 180° and thence extending the second lead layer parallelto the ABS across the middle portion of the MR stripe so as tomagnetically couple the second lead layer to the MR stripe when acurrent is conducted through the second lead layer.
 2. A method asclaimed in claim 1 including the steps of:forming the second lead layerin a single step of deposition so that the second lead layer is a singlethin film layer.
 3. A method as claimed in claim 2 including the stepsof:forming a ground strap layer in the same step of forming said secondlead layer; and connecting the ground strap layer to the first terminal.4. A method as claimed in claim 1 including the steps of:forming a firstshield layer; forming a first gap layer on the first shield layer;forming a mid-gap insulation layer on the MR stripe and the first gaplayer; and forming the second lead layer on the mid-gap insulationlayer.
 5. A method as claimed in claim 4 including the steps of:forminga second gap layer on the second lead layer and the mid-gap insulationlayer; forming a second shield layer on the second gap layer; andconnecting the first lead layer and the first and second shield layersto ground.
 6. A method as claimed in claim 5 including the stepsof:forming the second lead layer in a single step of deposition so thatthe second lead layer is a single thin film layer.
 7. A method asclaimed in claim 6 including the steps of:forming a ground strap layerin the same step of forming said second lead layer; and connecting theground strap layer to the second terminal.
 8. A method of making a thinfilm orthogonal magnetoresistive MR head which has an air bearingsurface (ABS) comprising the steps of:forming a single orthogonal MRsensor having first and second ends, the first end being at said ABS andthe second end being recessed from the ABS; forming a first lead layerwith first and second ends and forming a second lead layer with firstand second ends; connecting the first end of the first lead layer to afirst end portion of the MR sensor and connecting the first end of thesecond lead layer to a second end portion of the MR sensor so that theMR sensor has a middle portion between said first and second endportions; forming only first and second terminals for said MR sensor;connecting the second end of the first lead layer to the first terminaland connecting the second end of the second lead layer to the secondterminal so that the first and second lead layers and the MR sensor areconnected in series across the first and second terminals; and the stepof forming the second lead layer including extending a length portion ofthe second lead layer transversely across said middle portion of the MRsensor in a direction substantially parallel to said ABS with saidlength portion in series with all remaining length portions of thesecond lead layer, the first lead layer and the MR sensor so as toinduce a magnetic bias field into the MR sensor when a sense current isconducted through the MR sensor via said first and second terminals. 9.A method as claimed in claim 8 including the step of:forming a mid-gapinsulation layer separating the second lead layer from the MR sensorwith a via which connects the first end of the second lead layer to thesecond end of the MR sensor.
 10. A method as claimed in claim 9including the steps of:forming a first shield layer; forming a first gaplayer on top of the first shield layer; the step of forming the MRsensor forming the MR sensor on the first gap layer; the step of formingthe mid-gap insulation layer including forming the mid-gap insulationlayer on the MR sensor and the first gap layer; and separating saidtransverse portion of the second lead layer from the first shield layerby the first gap layer and the mid-gap insulation layer.
 11. A method ofmaking a thin film orthogonal magnetoresistive (MR) head which has anair bearing surface (ABS) comprising the steps of:forming a singleorthogonal MR sensor having first and second ends, the first end beingat said ABS and the second end being recessed from the ABS; forming afirst lead layer with first and second ends and forming a second leadlayer with first and second ends; connecting the first end of the firstlead layer to a first end portion of the MR sensor and connecting thefirst end of the second lead layer to a second end portion of the MRsensor so that the MR sensor has a middle portion between said first andsecond end portions; forming only first and second terminals for said MRsensor; connecting the second end of the first lead layer to the firstterminal and connecting the second end of the second lead layer to thesecond terminal so that the first and second lead layers and the MRsensor are connected in series across the first and second terminals;the step of forming the second lead layer including extending a lengthportion of the second lead layer transversely across said middle portionof the MR sensor in a direction substantially parallel to said ABS withsaid length portion in series with all remaining length portions of thesecond lead layer, the first lead layer and the MR sensor so as toinduce a magnetic bias field into the MR sensor when a sense current isconducted through the MR sensor via said first and second terminals;forming a mid-gap insulation layer separating the second lead layer fromthe MR sensor with a via which connects the first end of the second leadlayer to the second end of the MR sensor; forming a first shield layer;forming a first gap layer on top of the first shield layer; the step offorming the MR sensor forming the MR sensor on the first gap layer; thestep of forming the mid-gap insulation layer including forming themid-gap insulation layer on the MR sensor and the first gap layer;separating said transverse portion of the second lead layer from thefirst shield layer by the first gap layer and the mid-gap insulationlayer; forming a second shield layer; forming a second gap layer betweenthe first lead layer and the second shield layer; connecting the firstlead layer to the first shield layer through a via in the first gaplayer and to the second shield layer through a via in each of themid-gap insulation layer and the second gap layer; and connecting thefirst terminal to ground.
 12. A method of making the thin filmorthogonal MR head as claimed in claim 11 in combination with a magneticmedia drive comprising the steps of:providing a housing; supporting thehead in the housing; mounting medium moving means in the housing formoving a magnetic medium past the head in a transducing relationshiptherewith; connecting positioning means to the support for moving thehead to multiple positions with respect to a moving magnetic medium soas to process signals with respect to multiple tracks on the magneticmedium; and connecting control means to the head, the magnetic mediummoving means and the positioning means for controlling and processingsignals with respect to the head, controlling movement of the magneticmedium and controlling the position of the head.
 13. A method of makinga combined head which includes an orthogonal MR read head and aninductive write head which includes a second pole layer, the combinedhead having an air bearing surface (ABS), said method comprising thesteps of:forming a single orthogonal MR stripe which extendsperpendicular to the ABS, the MR stripe being bounded by first andsecond end edges and a pair of spaced apart side edges, the first endedge forming a portion of said ABS; forming the MR stripe with an easyaxis which extends substantially parallel to the ABS; connecting a firstend of a first lead layer to a first end portion of the MR stripeadjacent said ABS and connecting a first end of a second lead layer to asecond end portion of the MR stripe spaced apart from the first endportion so that the MR stripe has a middle portion between the first andsecond end portions and which is electrically insulated from the firstand second lead layers; forming only first and second terminals for theMR stripe; connecting a second end of the first lead layer to the firstterminal and connecting a second end of the second lead layer to thesecond terminal so that the MR stripe and the first and second leadlayers are connected in series across the first and second terminals;forming the second lead layer with a first portion which extendsparallel to the ABS away from the second end of the MR stripe, with asecond portion which extends from the first portion in a turn of atleast substantially 180° and with a third portion which extends from thesecond portion parallel to the ABS and across the middle portion of theMR stripe so as to be magnetically coupled to the MR stripe when a sensecurrent is conducted across said first and second terminals.
 14. Amethod as claimed in claim 13 including the step of:connecting alongitudinal biasing layer to each side edge of the MR stripe with eachlongitudinal biasing layer having first and second substantially planarsurfaces.
 15. A method as claimed in claim 14 including the stepof:forming an MR element which includes the MR stripe with substantiallyplanar surfaces which are substantially coextensive with the first andsecond planar surfaces respectively of each of the longitudinallybiasing layers.
 16. A method as claimed in claim 15 including the stepsof:forming the first lead layer with a portion which extends laterallyacross and in contact with said second planar surfaces of thelongitudinally biasing layers and the MR stripe; and forming saidportion of the first lead layer so that it forms a part of the ABS ofthe MR head.
 17. A method as claimed in claim 16 including the stepsof:forming the second pole layer with a width at the head surface; andforming said planar surface portions of the MR stripe and thelongitudinal biasing layers with a width which is greater than the widthof the second pole tip.
 18. A method as claimed in claim 17 includingthe steps of:forming a first shield layer; forming a first gap layerformed on the first shield layer; forming the MR stripe on the first gaplayer; forming a mid-gap insulation layer on the MR stripe and the firstgap layer; forming the first portion of the second lead so that it iselectrically connected to the MR stripe through a via in said mid-gapinsulation layer; and separating the second and third portions of thesecond lead layer from the first shield layer with the first gap layerand the mid-gap insulation layer.
 19. A method as claimed in claim 18including the steps of:forming a second shield layer; forming a secondgap layer between the first lead layer and the second shield layer;forming the MR stripe between the first and second shield layers;connecting the first lead layer to the first shield layer through a viain the first gap layer and to the second shield layer through a via ineach of the mid-gap insulation layer and the second gap layer; andconnecting the first terminal to ground.
 20. A method as claimed inclaim 19 including the steps of:forming the second lead layer with afourth portion which extends from the third portion and which isconnected to said second terminal; and separating the fourth portionfrom the first shield layer by the first gap layer and the mid-gapinsulation layer.
 21. A method as claimed in claim 20 including the stepof:forming the first, second, third and fourth portions of the secondlead layer as a single thin film layer.
 22. A method as claimed in claim21 including the step of:connecting a ground strap layer to the firstlead layer and the first terminal so that the ground strap layer issubstantially planar with the second layer.
 23. A method of making thecombined head as claimed in claim 22 in a magnetic media drive, themethod comprising the steps of:providing a housing; supporting thecombined head in the housing; mounting medium moving means in thehousing for moving a magnetic medium past the head in a transducingrelationship therewith; connecting positioning means to the support formoving the head to multiple positions with respect to a moving magneticmedium so as to process signals with respect to multiple tracks on themagnetic medium; and connecting control means to the head, the magneticmedium moving means and the positioning means for controlling andprocessing signals with respect to the head, controlling movement of themagnetic medium and controlling the position of the head.
 24. A methodof making a combined head which includes an orthogonal MR read head andan inductive write head which includes a second pole layer, the combinedhead having a head surface, said method comprising the steps of:forminga single orthogonal MR stripe which extends perpendicular to the headsurface, the MR stripe being bounded by first and second end edges and apair of spaced apart side edges, the first end edge forming a portion ofsaid head surface; forming the MR stripe with an easy axis which extendssubstantially parallel to the head surface; connecting a first leadlayer to a first end portion of the MR stripe adjacent said head surfaceand connecting a second lead layer to a second end portion of the MRstripe spaced apart from the first end portion so that the first andsecond lead layers and the MR stripe are connected in series, the secondlead layer extending across a middle portion of the MR stripe which islocated between the first and second end portions and the second leadlayer is electrically insulated from the middle portion; forming onlyfirst and second terminals; connecting the first lead layer to the firstterminal and connecting the second lead layer to the second terminal;and connecting a longitudinal biasing layer to each side edge of the MRstripe with each longitudinal biasing layer having first and secondsubstantially planar surfaces.
 25. A method as claimed in claim 24including the step of:forming an MR element which includes the MR stripewith substantially planar surfaces which are substantially coextensivewith the first and second planar surfaces respectively of each of thelongitudinally biasing layers.
 26. A method as claimed in claim 25including the steps of:forming the first lead layer with a portion whichextends laterally across and in contact with said second planar surfacesof the longitudinally biasing layers and the MR stripe; and forming saidportion of the first lead layer so that it forms a part of the ABS ofthe MR head.
 27. A method as claimed in claim 26 including the stepsof:forming the second pole layer with a width at the head surface; andforming said planar surface portions of the MR stripe and thelongitudinal biasing layers with a width which is greater than the widthof the second pole tip.
 28. A method as claimed in claim 27 includingthe step of:forming the second lead layer with a first portion whichextends laterally in a first direction from the connection of the secondlead layer to the MR stripe, with a second portion which extends in asecond direction toward the head surface from the first portion and witha third portion which extends laterally in a third directionsubstantially opposite to said first direction so that the third portionextends across the middle portion of the MR stripe.
 29. A method asclaimed in claim 28 including the steps of:forming a first shield layer;forming a first gap layer formed on the first shield layer; forming theMR stripe on the first gap layer; forming a mid-gap insulation layer onthe MR stripe and the first gap layer; forming the first portion of thesecond lead so that it is electrically connected to the MR stripethrough a via in said mid-gap insulation layer; and separating thesecond and third portions of the second lead layer from the first shieldlayer with the first gap layer and the mid-gap insulation layer.
 30. Amethod as claimed in claim 29 including the steps of:forming a secondshield layer; forming a second gap layer between the first lead layerand the second shield layer; forming the MR stripe between the first andsecond shield layers; connecting the first lead layer to the firstshield layer through a via in the first gap layer and to the secondshield layer through a via in each of the mid-gap insulation layer andthe second gap layer; and connecting the first terminal to ground.
 31. Amethod as claimed in claim 30 including the steps of:forming the secondlead layer with a fourth portion which extends from the third portionand which is connected to said second terminal; and separating thefourth portion from the first shield layer by the first gap layer andthe mid-gap insulation layer.
 32. A method as claimed in claim 31including the step of:forming the first, second, third and fourthportions of the second lead layer as a single thin film layer.
 33. Amethod as claimed in claim 32 including the step of:connecting a groundstrap layer to the first lead layer and the first terminal so that theground strap layer is substantially planar with the second lead layer.34. A method of making the combined head as claimed in claim 33 in amagnetic media drive, the method comprising the steps of:providing ahousing; supporting the combined head in the housing; mounting mediummoving means in the housing for moving a magnetic medium past the headin a transducing relationship therewith; connecting positioning means tothe support for moving the head to multiple positions with respect to amoving magnetic medium so as to process signals with respect to multipletracks on the magnetic medium; and connecting control means to the head,the magnetic medium moving means and the positioning means forcontrolling and processing signals with respect to the head, controllingmovement of the magnetic medium and controlling the position of thehead.